Title | Interference of coexisting copper and aluminum on the ammonium thiosulfate leaching of gold from printed circuit boards of waste mobile phones. |
Authors | Jeon S., Tabelin C.B., Takahashi H., Park I., Ito M. and Hiroyoshi N. |
Publication date | 2018 |
Journal | Waste Management |
Volume | 81 |
Pages | 148-156 |
Publisher | Elsevier |
DOI |